Calibration Method for a Lithographic Apparatus

ABSTRACT

A first substrate  2002  has a calibration pattern applied to a first plurality of fields  2004  by a lithographic apparatus. Further substrates  2006, 2010  have calibration patterns applied to further pluralities of fields  2008, 2012 . The different pluralities of fields have different sizes and/or shapes and/or positions. Calibration measurements are performed on the patterned substrates  2002, 2006, 2010  and used to obtain corrections for use in controlling the apparatus when applying product patterns to subsequent substrates. Measurement data representing the performance of the apparatus on fields of two or more different dimensions (fields  2004, 2008, 2012  in this example) is gathered together in a database  2013  and used to synthesize the information needed to calibrate the apparatus for a new size. Calibration data is also obtained for different scan and step directions.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. patent application Ser. No.15/736,451, 371(c) Date Dec. 14, 2017, which is a National Stage Entryof Int'l Application No. PCT/EP2016/062070, filed May 27, 2016, whichclaims priority of EP Application 15172798.9, filed on Jun. 18, 2015 andEP application 15200409.9, filed on Dec. 16, 2015, which areincorporated by reference herein in their entirety.

FIELD

The invention relates to lithographic apparatuses, and in particular tocalibration methods for lithographic apparatuses and computer programproducts for implementing such methods. The invention further relates tomethods of device manufacture.

BACKGROUND

A lithographic process is one that applies a desired pattern onto asubstrate, usually onto a target portion of the substrate. Alithographic apparatus can be used, for example, in the manufacture ofintegrated circuits (ICs). In that instance, a patterning device, whichis alternatively referred to as a mask or a reticle, may be used togenerate a circuit pattern to be formed on an individual layer of theIC. This pattern can be transferred onto a field (e.g. comprising partof, one, or several product dies) on a substrate (e.g. a silicon wafer).Transfer of the pattern is typically via imaging onto a layer ofradiation-sensitive material (resist) provided on the substrate.Stepping and/or scanning movements can be involved, to repeat thepattern at successive target portions across the substrate. It is alsopossible to transfer the pattern from the patterning device to thesubstrate by imprinting the pattern onto the substrate. In the followingdescription of examples, the term “exposure” may be used for convenienceto refer to the step of applying a pattern to a field or to a substrate,without indicating any limitation to optical imaging or to excludeimprinting.

A key performance parameter of the lithographic apparatus is the overlayerror. This error, often referred to simply as “overlay”, is the errorin placing a product features in the correct position relative tofeatures formed in previous layers. As device structures become everysmaller, overlay specifications become ever tighter. Overlay will beused as a main example of performance parameter in the presentdisclosure, while the concepts and techniques disclosed herein can inprinciple be applied to the measurement and improvement of otherperformance parameters as well. Examples of performance parameters of alithographic process include for example critical dimension (CD), CDuniformity and the like.

Currently the overlay error is controlled and corrected by means ofmethods such as advanced process control (APC) described for example inUS2012008127A1 and wafer alignment models described for example inUS2013230797A1.

Within the lithographic apparatus, wafer alignment models areconventionally applied based on measurement of alignment marks providedon the substrate. The measurements are made by the lithographicapparatus as a preliminary step of every patterning operation. Thealignment models may include higher order models, to correct fornon-linear distortions of the wafer. The alignment models may also beexpanded to take into account other measurements and/or calculatedeffects such as thermal deformation during a patterning operation

During operation, advanced process control is able to stabilizeperformance of a lithographic apparatus, but, to achieve goodperformance in the first place, it is generally necessary to perform acalibration of the apparatus after any interruption in operation.Calibration, broadly speaking, involves (i) using the apparatus, (ii)measuring the performance of the apparatus and (iii) based on errorsobserved in the measured performance, controlling the apparatus tocorrect the errors and improve performance in subsequent production. Toachieve the highest possible performance, many individual variables haveto be measured and taken into account.

As an example of such variables, some errors may be classed as“intra-field” errors that recur systematically depending on the positionwithin each field. Other errors may be classed as “inter-field” errorsthat recur systematically as a function of position on the substrate asa whole. Furthermore, overlay in a particular field may be dependent onthe particular scanning direction and/or stepping direction that is usedby the lithographic apparatus to expose all the fields in an efficientmanner. Changes in the product field size and/or exposure sequence maytherefore change the performance of the apparatus. Consequently, toobtain highest performance currently requires new calibration of thelithography apparatus for each change in the product pattern (fieldsize), or even if a new exposure sequence or new grid positioning is tobe used. Calibration may have to be performed separately for each chuck(substrate support) that may be used within the apparatus. Production isinterrupted during the calibration. This directly reduces the productionthroughput of the lithographic apparatus. If the apparatus will be usedfor a long period to produce the same product, the lost throughput maybe acceptable. Other times, however, a lithographic apparatus is used toproduce a number of different product layouts day-by-day orhour-by-hour, according to customer demand. Recalibrating the apparatusfor each individual layout or sequence is unfeasible, even forrelatively modest numbers of individual layouts, since it wouldsignificantly reduce production throughput.

SUMMARY

It is therefore desirable to reduce the amount of time required tocalibrate a lithographic apparatus. Additionally, it is desirable toimprove the accuracy of the lithographic apparatus by reducing theoverlay error due to the specific movements of the lithographicapparatus.

According to a first aspect of the present invention, there is providedmethod of calibrating a lithographic apparatus, comprising:

-   -   providing first measurement data for a first plurality of fields        that have been applied by the lithographic apparatus on one or        more substrates, each field in the first plurality of fields        having a first layout;    -   providing further measurement data for one or more further        pluralities of fields that have been applied by the lithographic        apparatus on one or more substrates, each of the one or more        further pluralities of fields having a layout different from the        first layout;    -   creating a prediction function based on the first measurement        data and the further measurement data; and    -   using the prediction function to determine a set of data for at        least a first plurality of product fields having a product        layout.

The set of data may directly or indirectly be used to obtain correctionparameters for the lithographic apparatus to use when applying a productpattern to a substrate. The product fields may have product fielddimensions different from both the first field dimensions and thefurther field dimensions. The product fields alternatively or inaddition may have positions shifted relative to the fields of the firstplurality of fields and further plurality of fields. Correctionparameters specific to the product field dimensions can be obtained,regardless whether the product field dimensions and/or positions aredifferent to the calibration field dimensions.

In a particular embodiment, the prediction function predicts overlayperformance of the lithographic apparatus, and is used to correctoverlay when applying a product pattern to product fields on a substrateusing a product layout.

The set of correction parameters may be parameters for an alignmentmodel.

The method may further comprise using the determined data to derivecorrection parameters for use in controlling the lithographic apparatusto apply a product pattern to plurality of fields on a productsubstrate. The method may further comprise using the correctionparameters to control the lithographic apparatus when applying theproduct pattern to a substrate in fields having the product fieldlayout.

In some embodiments of the invention, prediction functions are obtainedwith regard to inter-field contributions and intra-field contributionsseparately.

In some embodiments of the invention, prediction functions are obtainedthat can be used to predict performance for different specific exposuresequences. For example, in a scanning type of patterning operation,specific prediction functions can provide predictions of performance fora field specific to the scanning and stepping directions used to apply apattern to that field in a given exposure sequence. The predictions canbe obtained regardless whether actual calibration substrates have beenproduced using that field size or using that exposure sequence.

The invention further provides a method of manufacturing devices byusing a lithographic apparatus to apply product patterns to substrates,the lithographic apparatus applying said product patterns to fieldshaving a product layout using correction parameters obtained by themethod according to any aspect of the invention as set forth above or inthe embodiments below.

The invention further provides a computer program product comprisingmachine-readable instructions for causing a data processing apparatus orapparatuses to implement a method of calibration according to any aspectof the invention as set forth above or in the embodiments below.

These and further features and advantages of the invention will beapparent to the skilled reader from a consideration of the detaileddescription of examples that follows.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the invention will now be described, by way of exampleonly, with reference to the accompanying schematic drawings in whichcorresponding reference symbols indicate corresponding parts, and inwhich:

FIG. 1 depicts a lithographic apparatus together with other apparatusesforming a production facility for semiconductor devices;

FIG. 2 depicts the principle of a calibration method according to anembodiment of the invention;

FIG. 3 shows schematically an example of a calibration pattern usable inthe method of FIG. 2;

FIG. 4 is a flowchart of a calibration method according to an embodimentof the invention;

FIG. 5 is a schematic diagram of a calibration substrate patterned by alithographic apparatus with a first exposure sequence in the method ofFIG. 4;

FIG. 6 illustrates the application of calibration patterns on acalibration substrate with four different exposure sequences in themethod of FIG. 4;

FIG. 7 illustrates the extraction of different subsets of measurementdata from four calibration patterns in the method of FIG. 4;

FIGS. 8A-8B illustrate the assembly of is a schematic illustration of anestimation step of the method illustrated in FIG. 4; and

FIG. 9 depicts another application of the calibration method of FIG. 2.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

Before describing embodiments of the invention in detail, it isinstructive to present an example environment in which embodiments ofthe present invention may be implemented.

FIG. 1 at 200 shows a lithographic apparatus LA as part of an industrialproduction facility implementing a high-volume, lithographicmanufacturing process. In the present example, the manufacturing processis adapted for the manufacture of for semiconductor products (integratedcircuits) on substrates such as semiconductor wafers. The skilled personwill appreciate that a wide variety of products can be manufactured byprocessing different types of substrates in variants of this process.The production of semiconductor products is used purely as an examplewhich has great commercial significance today.

Within the lithographic apparatus (or “litho tool” 200 for short), ameasurement station MEA is shown at 202 and an exposure station EXP isshown at 204. A control unit LACU is shown at 206. In this example, eachsubstrate visits the measurement station and the exposure station tohave a pattern applied. In an optical lithographic apparatus, forexample, a projection system is used to transfer a product pattern froma patterning device MA onto the substrate using conditioned radiationand a projection system. This is done by forming an image of the patternin a layer of radiation-sensitive resist material.

The term “projection system” used herein should be broadly interpretedas encompassing any type of projection system, including refractive,reflective, catadioptric, magnetic, electromagnetic and electrostaticoptical systems, or any combination thereof, as appropriate for theexposure radiation being used, or for other factors such as the use ofan immersion liquid or the use of a vacuum. The patterning MA device maybe a mask or reticle, which imparts a pattern to a radiation beamtransmitted or reflected by the patterning device. Well-known modes ofoperation include a stepping mode and a scanning mode. As is well known,the projection system may cooperate with support and positioning systemsfor the substrate and the patterning device in a variety of ways toapply a desired pattern to many fields across a substrate. Programmablepatterning devices may be used instead of reticles having a fixedpattern. The radiation for example may include electromagnetic radiationin the deep ultraviolet (DUV) or extreme ultraviolet (EUV) wavebands.The present disclosure is also applicable to other types of lithographicprocess, for example imprint lithography and direct writing lithography,for example by electron beam.

The lithographic apparatus control unit LACU which controls all themovements and measurements of various actuators and sensors to receivesubstrates W and reticles MA and to implement the patterning operations.LACU also includes signal processing and data processing capacity toimplement desired calculations relevant to the operation of theapparatus. In practice, control unit LACU will be realized as a systemof many sub-units, each handling the real-time data acquisition,processing and control of a subsystem or component within the apparatus.

Before the pattern is applied to a substrate at the exposure stationEXP, the substrate is processed in at the measurement station MEA sothat various preparatory steps may be carried out. The preparatory stepsmay include mapping the surface height of the substrate using a levelsensor and measuring the position of alignment marks on the substrateusing an alignment sensor. The alignment marks are arranged nominally ina regular grid pattern. However, due to inaccuracies in creating themarks and also due to deformations of the substrate that occurthroughout its processing, the marks deviate from the ideal grid.Consequently, in addition to measuring position and orientation of thesubstrate, the alignment sensor in practice must measure in detail thepositions of many marks across the substrate area, if the apparatus isto print product features at the correct locations with very highaccuracy. The apparatus may be of a so-called dual stage type which hastwo substrate tables, each with a positioning system controlled by thecontrol unit LACU. While one substrate on one substrate table is beingexposed at the exposure station EXP, another substrate can be loadedonto the other substrate table at the measurement station MEA so thatvarious preparatory steps may be carried out. The measurement ofalignment marks is therefore very time-consuming and the provision oftwo substrate tables enables a substantial increase in the throughput ofthe apparatus. If the position sensor IF is not capable of measuring theposition of the substrate table while it is at the measurement stationas well as at the exposure station, a second position sensor may beprovided to enable the positions of the substrate table to be tracked atboth stations. Lithographic apparatus LA in this example is of aso-called dual stage type which has two substrate tables WTa and WTb andtwo stations—an exposure station and a measurement station—between whichthe substrate tables can be exchanged.

Within the production facility, apparatus 200 forms part of a “lithocell” or “litho cluster” that contains also a coating apparatus 208 forapplying photosensitive resist and other coatings to substrates W forpatterning by the apparatus 200. At an output side of apparatus 200, abaking apparatus 210 and developing apparatus 212 are provided fordeveloping the exposed pattern into a physical resist pattern. Betweenall of these apparatuses, substrate handling systems take care ofsupporting the substrates and transferring them from one piece ofapparatus to the next. These apparatuses, which are often collectivelyreferred to as the track, are under the control of a track control unitwhich is itself controlled by a supervisory control system SCS, whichalso controls the lithographic apparatus via lithographic apparatuscontrol unit LACU. Thus, the different apparatus can be operated tomaximize throughput and processing efficiency. Supervisory controlsystem SCS receives recipe information R which provides in great detaila definition of the steps to be performed to create each patternedsubstrate.

Once the pattern has been applied and developed in the litho cell,patterned substrates 220 are transferred to other processing apparatusessuch as are illustrated at 222, 224, 226. A wide range of processingsteps is implemented by various apparatuses in a typical manufacturingfacility. For the sake of example, apparatus 222 in this embodiment isan etching station, and apparatus 224 performs a post-etch annealingstep. Further physical and/or chemical processing steps are applied infurther apparatuses, 226, etc. Numerous types of operation can berequired to make a real device, such as deposition of material,modification of surface material characteristics (oxidation, doping, ionimplantation etc.), chemical-mechanical polishing (CMP), and so forth.The apparatus 226 may, in practice, represent a series of differentprocessing steps performed in one or more apparatuses. As anotherexample, apparatus and processing steps may be provided for theimplementation of self-aligned multiple patterning, to produce multiplesmaller features based on a precursor pattern laid down by thelithographic apparatus.

As is well known, the manufacture of semiconductor devices involves manyrepetitions of such processing, to build up device structures withappropriate materials and patterns, layer-by-layer on the substrate.Accordingly, substrates 230 arriving at the litho cluster may be newlyprepared substrates, or they may be substrates that have been processedpreviously in this cluster or in another apparatus entirely. Similarly,depending on the required processing, substrates 232 on leavingapparatus 226 may be returned for a subsequent patterning operation inthe same litho cluster, they may be destined for patterning operationsin a different cluster, or they may be finished products to be sent fordicing and packaging.

Each layer of the product structure requires a different set of processsteps, and the apparatuses 226 used at each layer may be completelydifferent in type. Further, even where the processing steps to beapplied by the apparatus 226 are nominally the same, in a largefacility, there may be several supposedly identical machines working inparallel to perform the step 226 on different substrates. Smalldifferences in set-up or faults between these machines can mean thatthey influence different substrates in different ways. Even steps thatare relatively common to each layer, such as etching (apparatus 222) maybe implemented by several etching apparatuses that are nominallyidentical but working in parallel to maximize throughput. In practice,moreover, different layers require different etch processes, for examplechemical etches, plasma etches, according to the details of the materialto be etched, and special requirements such as, for example, anisotropicetching.

The previous and/or subsequent processes may be performed in otherlithography apparatuses, as just mentioned, and may even be performed indifferent types of lithography apparatus. For example, some layers inthe device manufacturing process which are very demanding in parameterssuch as resolution and overlay may be performed in a more advancedlithography tool than other layers that are less demanding. Thereforesome layers may be exposed in an immersion type lithography tool, whileothers are exposed in a ‘dry’ tool. Some layers may be exposed in a toolworking at DUV wavelengths, while others are exposed using EUVwavelength radiation.

In order that the substrates that are exposed by the lithographicapparatus are exposed correctly and consistently, it is desirable toinspect exposed substrates to measure properties such as overlay errorsbetween subsequent layers, line thicknesses, critical dimensions (CD),etc. Accordingly a manufacturing facility in which litho cell LC islocated also includes metrology system which receives some or all of thesubstrates W that have been processed in the litho cell. Metrologyresults are provided directly or indirectly to the supervisory controlsystem SCS. If errors are detected, adjustments may be made to exposuresof subsequent substrates, especially if the metrology can be done soonand fast enough that other substrates of the same batch are still to beexposed. Also, already exposed substrates may be stripped and reworkedto improve yield, or discarded, thereby avoiding performing furtherprocessing on substrates that are known to be faulty. In a case whereonly some target portions of a substrate are faulty, further exposurescan be performed only on those target portions which are good.

The metrology system in FIG. 1 includes a metrology apparatus 240 whichis provided for making measurements of parameters of the products atdesired stages in the manufacturing process. A common example of ametrology station in a modern lithographic production facility is ascatterometer, for example an angle-resolved scatterometer or aspectroscopic scatterometer, and it may be applied to measure propertiesof the developed substrates at 220 prior to etching in the apparatus222. Using metrology apparatus 240, it may be determined, for example,that important performance parameters such as overlay or criticaldimension (CD) do not meet specified accuracy requirements in thedeveloped resist. Prior to the etching step, the opportunity exists tostrip the developed resist and reprocess the substrates 220 through thelitho cluster. As is also well known, the metrology results 242 from theapparatus 240 can be used to maintain accurate performance of thepatterning operations in the litho cluster, by supervisory controlsystem SCS and/or control unit LACU 206 making small adjustments overtime, thereby minimizing the risk of products being madeout-of-specification, and requiring re-work. Of course, metrologyapparatus 240 and/or other metrology apparatuses (not shown) can beapplied to measure properties of the processed substrates 232, 234, andincoming substrates 230.

As is well known, the pattern applied in one exposure covers only asmall portion of the substrate at a time, and the same pattern istypically applied repeatedly over the substrate to make full use of thecapacity of the substrate and of the production facility as a whole. Theportion to which the pattern is applied is termed a “field”, and itsmaximum size is limited by the field of view of the optical projectionsystem and other limitations of the apparatus design. On the other hand,not all products require a die which fits neatly within that maximumfield size. Wasted space on a substrate is not tolerable in view of thecost of establishing and running the production facility, and so foreach product a particular size and shape smaller than the maximum sizewill generally be selected. In the example of the scanning mode ofoperation, the lithographic apparatus can be controlled to operate witha shorter scan length and/or a shorter step size, to ensure optimumfilling of the substrate area with fields of and particular size andshape.

As explained in the introduction, to obtain best performance in terms ofoverlay or other performance parameters, a set of calibrationmeasurements is performed on one or several substrates to whichcalibration patterns have been applied by the individual lithographicapparatus. The calibration patterning operations impact the throughputof product substrates. One particular problem in this regard is thatoverlay performance of a particular lithographic apparatus will bedifferent for different products and layouts. For example some layoutshave different field sizes. An operator may wish to use the samelithographic tool for several products, each with a different fieldsize. Even if the field size does not change, other parameters of theexposure process may change, for example the sequence of up/down andleft/right movements used in the exposure of fields in a grid layout,and/or the position of the grid relative to the substrate. Therefore toobtain best performance it may be necessary to carry out calibrationsspecific to each product and each grid layout, before startingproduction of the product. This significantly increases the time, andthereby cost, of the calibration process.

FIG. 2 shows the principle of an exemplary method of calibrationaccording to an aspect of the present disclosure. A first substrate 2002has a calibration pattern applied to a first plurality of fields 2004.In the present example, the substrate is a calibration substrate onwhich a calibration pattern is applied to a plurality of equally sizedand spaced fields. A second substrate 2006 has a calibration patternapplied to a plurality of fields 2008. A third substrate 2010 has acalibration pattern applied to a plurality of fields 2012. While thepresent example describes the use of dedicated calibration patterns anddedicated calibration substrates, the terms “calibration pattern” and“calibration substrate” are not intended to exclude the use of actualproduct patterns for the purposes of calibration.

The fields 2004, 2008, 2012 on the first, second and third substrateshave different sizes and shapes, as shown in the FIG. 2. Each field has,for example, a height in a Y direction and a width in an X direction.(It will be understood that these terms refer only to the appearance ofthe pattern in the plane of the substrate, and not to height relative toearth or gravity). In other words, each field 2004 on the firstsubstrate has a first set of field dimensions, each field in the secondplurality has a second set of unique field dimensions, and each field inthe third plurality has a third set of unique field dimensions.Substrates 2002, 2006 and 2010 are shown in FIG. 2 as separatesubstrates, which may be a convenient implementation. Different fieldsizes could in principle be mixed on a single substrate, provided thatthe performance of the apparatus in applying patterns with thesedifferent field sizes can be measured separately. Methods for obtainingmultiple measurements on one substrate will be explained in furtherdetail below.

As mentioned above, the maximum size of a field is determined by thedesign of the lithographic apparatus. In the illustrated example, thefields 2004 on substrate 2002 have this maximum field size. Accordingly,particular products will generally be designed and laid out usingsmaller fields. Fields 2008 have a “short, fat” size and shape, whilefields 2012 have a “tall, thin” size and shape. The exemplary method isnot limited to three sets of field dimensions, and it may be desirableto use one, two, four, five or more different sizes and shapes to obtainthe best performance. (In other examples it may be that field size willnot vary, or that performance is not sensitive to field size as much asit is to other parameters of interest.)

In the method disclosed herein calibration measurements are performed onthe patterned substrates 2002, 2006, 2010 and used to obtain correctionsfor use in controlling the lithographic apparatus when applying productpatterns to subsequent substrates. In the present method, however,calibration substrates and measurements are not prepared for everydifferent size and shape of product field. Rather, measurement datarepresenting the performance of the apparatus on fields of two or moredifferent dimensions (fields 2004, 2008, 2012 in this example) isgathered together in a database 2013 and used to synthesize theinformation needed to calibrate the apparatus for a new size. From thedatabase of measurements of calibration substrates with different fieldsizes, a prediction function 2014 is derived that can be used to obtaincorrections specific to product field sizes, but without the need tomake physical calibration patterns and measurements specific to thosefield sizes. The prediction function is used to simulate the performanceof the lithographic apparatus when applying a product pattern with aparticular product field size and shape.

As an example, a designed product field layout for a product substratecomprises a number of fields 2016. In this example, each field has aparticular set of field dimensions which is different to the dimensionsof the fields 2004, 2008, 2012. The designed product field layout isused as input for the prediction function 2015. The resulting output ofthe prediction function is a specific performance model 2018 forpredicting the performance of the lithographic apparatus when patterninga substrate using the product field size. The predicted behavior can beused as input for a correction model in a lithographic apparatus, suchas an alignment model to improve overlay performance. Metrologyapparatus 240 of FIG. 1 can be used to make the measurements. Themeasurement data can be delivered as data 242 to database 2014 that lieswithin the supervisory control system, or it may lie within thelithographic apparatus control unit LACU. In any case, the control unitLACU in due course receives the information it requires for correctingany performance errors predicted by the specific performance model, anduses the information to improve performance when exposing product fieldson real product substrates.

It will be appreciated that the corrections to be applied are (at leastat a simplistic level) an inverse of errors predicted in the specificperformance model. Accordingly, it is a matter of implementation whetherthe prediction function 2015 delivers its output firstly in the form ofa prediction, which then has to be converted to correction parameters,or whether it is arranged to deliver directly the necessary correctionparameters. To a large extent the implementation will depend simply onwhat form of data is easiest to handle by the control unit and itssubsystems. The predicted performance model and/or correction parameterscan be combined with corrections from other sources, such as thestability module, substrate process history and the like, to obtain acomplete set of corrections. Of course for the individual substrate, thecontrol unit also uses the alignment model based on measurements takenby alignment sensors and level sensors in the measuring station MEA,immediately prior to exposure.

As described above, calibration measurements in accordance with oneembodiment of the method are carried out on a plurality of calibrationpatterns applied to one or more calibration substrates. FIG. 3 shows anexemplary calibration substrate 302. The substrate is divided into anumber of fields 304, each of which has a calibration pattern 306applied to it. The pattern may be defined by providing a specialcalibration patterning device in the lithographic apparatus.Alternatively, a real product design may contain features usable forcalibration. In one example, the target pattern comprises overlaytargets located in target areas 308 uniformly spaced in a grid patternacross every field. As illustrated in the enlarged insert, each targetarea 308 may contain a plurality of individual targets 310, 312, 314,316 etc. These targets are offset from one another by small amounts,while remaining at the general location of the area 308. This provisionof multiple targets with offsets is to allow multiple exposures andmultiple overlay measurements to be performed on the same substrate andat substantially the same locations. The offsets may be for examplemeasured in tens of microns, while the field size is measured in tens ofmillimeters.

In the case of overlay targets, each individual target typicallycomprises a bottom mark in an underlying layer and a top mark to beformed in the present lithographic apparatus. The bottom marks may havebeen formed using the same lithographic apparatus or a different one.During application of a calibration pattern, a top mark is appliedoverlying a particular bottom mark in each target area 308. For example,in a particular calibration patterning operation, top mark 310 a may beapplied over bottom mark 310 b. During a calibration measurement, theoverlay error between the top target mark and the bottom target mark ismeasured. Overlay error causes the marks to be misaligned in one or bothof the X and Y directions.

Within each individual target, features may typically be provided toallow measurement in both X and Y directions in a single structuretarget, or different targets may be provided in a composite target, formeasuring overlay in X and Y separately. The drawing shows each targetas a simple “box-in-box” target for the sake of illustration only. Thetargets may indeed be of ‘box-in-box’ type suitable for image-basedoverlay metrology; according to modern techniques, however, they may begratings, to be measured by diffraction-based overlay in a well-knownmanner. Hybrid targets having both image and grating features may beused. The exact type of target, and indeed the manner of measuring, is amatter of implementation. As mentioned, overlay is not the onlyperformance parameter that might be measured, and other types of targetand other metrology techniques may be applied, as appropriate to theparameters of interest.

As an example, each specific target in an overlay target area 308 mayhave been applied separately during successive exposures using differentfield sizes. As will be described further below, it may be desired thatthe prediction function 2015 can generate a performance model andcorrection parameters that take account of inter-field variations andintra-field variations in performance for the given product field size.It may further be desired that the prediction function 2015 can generatea performance model and correction parameters that take account ofsubtle variations in performance that are associated with differentscanning directions and/or stepping direction. In other words, acalibration is desired that is specific to a particular exposuresequence, as well as a particular field size and shape, in order toobtain best performance.

Accordingly, in an example, it may be that target 310 has been formedduring a first patterning operation, using a first set of fielddimensions and a first combination of scan and step directions.Similarly, target 312 has been formed during a second patterningoperation on the same field, using the first set of field dimensions anda second combination of scan and step directions. Target 314 has beenformed during a third patterning operation, using the first set of fielddimensions and a third combination of scan and step directions. Target316 has been formed during a fourth patterning operation, using thefirst set of field dimensions and a fourth combination of scan and stepdirections. In this way, four sets of measurement data can be gatheredfrom the one substrate. These four sets of measurement data can be usedto develop the prediction function, as will be described in more detailbelow. By suitable design, it is possible to apply all the calibrationmarks in the same resist layer by multiple exposures. Alternatively onecould make four cycles of coating, exposure and development.

Alternatively or additionally, targets in an overlay target area may beapplied during successive exposures using different field dimensions.Whether this is possible will depend on the design of the calibrationpattern. Using the example where three different field sizes are used toobtain measurement data for the database 2014, it will be noticed thatthe twelve targets in each area 308 conveniently allow for four sets ofmeasurement data to be gathered for each of the three unique fileddimensions (2004, 2008, 2012).

As a general point, the skilled reader will know that metrology in thistechnical field typically requires that each value be measured severaltimes to obtain a statistically reliable measurement and to eliminate asfar as possible the effects of random error sources. Thus, for example,each set of calibration patterns may in practice be applied to severaldifferent substrates and each applied mark may be measured several timesto obtain a single value for the overlay performance of the lithographicapparatus at that mark position. Any discussion of a patterningoperation or a measurement in the present application therefore shouldbe taken to refer potentially to the performance of several identicaloperations. The need to repeat patterning and measurement to obtain thehighest accuracy highlights again the penalty in throughput that isincurred when a calibration has to be performed in a productionfacility.

While in this example a reference image providing multiple individualtarget marks with shifts is illustrated, this is not essential. Otherembodiments may be envisaged in which multiple marks are printed withshifts relative to a single reference mark, and separate measurementvalues can be obtained from them. As also illustrated, even with thetypes of mark illustrated, multiple exposures can be made withoutshifts, where a pattern is applied at different field positions acrossthe substrate, or different portions of a field are patterned indifferent exposures.

With reference to FIG. 4, a method 400 for carrying out a calibrationaccording to the principles described above will now be described. Thereference numerals in this figure refer to the following steps, each ofwhich will be explained in more detail (with reference also to the otherdrawings):

402: apply calibration patterns to one or more substrates usingdifferent field dimensions;

404: perform calibration measurements on the calibration patterns;

406: group measurement data into sets and/or subsets, for example basedon scan and step directions;

408: extract intra-field and inter-field fingerprints for each setand/or subset;

410: create prediction function;

412: use prediction function to predict performance for product fieldshaving a new field dimensions and/or new exposure sequence; and

414: use predicted performance to obtain correction model for use incontrolling operation of lithographic apparatus to expose productfields.

As will be seen from the drawing, the steps 402 to 408 are performedmore than once, to create and measure calibration patterns usingdifferent field dimensions. The steps to obtain the measurement data foreach set of field dimensions is the same, and so will only be describedonce.

In step 402 of the method 400 a calibration pattern is applied tosuccessive fields across a calibration substrate, as will now bediscussed in detail with reference to FIGS. 5 and 6. (FIG. 3 may also berecalled, for detail of the calibration pattern.)

As shown in FIG. 5, a calibration substrate 502 is divided into a numberof fields 504 that are arranged in a grid pattern. During a patterningoperation, patterns are applied to each field on the substrate in anexposure sequence. In a scanning-type lithographic apparatus, theexposure sequence comprises a sequence of stepping and scanningmovements by which each field on a substrate is patterned in anefficient or advantageous manner. By convention, the stepping directionis aligned with the X axis of the substrate coordinate system. Thescanning direction is aligned with the Y axis of the substratecoordinate system. It is to be noted that the stepping and scanningmovements to be described are purely relative movements between thepatterning device, the optical projection system and the substrateduring a patterning operation. These relative movements can be effectedin a number of ways. In principle, it does not matter which componentsmove and which remain static, so long as overall their relativemovements achieve the desired image formation and image placement. Inpractical apparatuses, in the scanning mode of operation, movements ofthe patterning device and the substrate are controlled in a carefullysynchronized manner, while the projection system remains stationary. Onthe other hand, for purposes of illustration, the operation can bevisualized as if the lithographic apparatus were stepping and scanningover the substrate.

With that in mind, an example exposure sequence for an example fieldsize is indicated by the dashed arrows 518, 520 in the detailed viewsabove the main portion of the figure. Each field is patterned byscanning either in the positive Y direction (referred to for example asthe “scan up” direction) 510 or in the negative Y direction (the “scandown” direction) 512. After exposing a particular field, the apparatussteps in either the negative X direction 514 (referred for example as“stepping left”) or in the positive X direction 516 (referred to as“stepping right”). After a left or right step, a next field is typicallypatterned in the opposite direction to that of the previous field. Thus,if a particular field has been exposed by scanning in the “up”direction, the next field is exposed by scanning in the “down”direction. This minimizes unnecessary movement of the lithographicapparatus, thereby reducing the amount of time required to process eachsubstrate. On the other hand, it does mean that each field is exposedusing a slightly set of movements. This is the reason that overlay canvary between fields in a systematic manner, depending on the scan andstep directions.

It will be understood that the labels “up”, “down”, “left” and “right”are merely convenient labels for explanation and understanding, and tonot refer to any particular orientation or reference frame in thephysical world. Typically the stepping motion is performed so that thenext field is the immediately adjacent field, but alternative sequencescan be implemented if they are found to be advantageous.

In this fashion, the calibration pattern is applied successively to eachfield in a particular row of fields on the calibration substrate, whilestepping generally in a left-to-right or a right-to-left direction. Whenone row of fields has been patterned, the lithographic apparatus appliesthe calibration pattern to the next row of fields, but (usually)stepping in the opposite direction to the previous row. In the presentexample, it is considered that the “top” row of fields is exposed first,by stepping in a left-to-right direction (arrow 506), and the next rowof fields is exposed in a right-to-left direction (arrow 508).

On the first few fields in FIG. 5, up and down arrows illustrate thescanning direction used when exposing each field. Further, hatching isused to indicate for each field which combination of scan and stepdirections is used. The insert below the main figure shows how differenthatching represents each of the four scan and step combinations used toapply the pattern to different fields on the calibration substrate inthe present example. These are: scan up/step right 518; scan down/stepright 520; scan up/step left 522; and scan down/step left 524.

As explained above, overlay performance of the lithographic apparatus ina particular field may be partly dependent on the scanning and steppingdirection used during the exposure (patterning) of that field.Consequently, as an example overlay performance in a particular fieldthat has been patterned using the up/left combination may differ in asmall but systematic way from overlay performance in an identical fieldthat has been patterned using the down/right combination. Thecalibration method can correct for this systematic error, provided ithas suitable sets of measurement data from which to observe thesystematic effects. For this reason, in the illustrated method, eachfield on the calibration substrate is patterned several times.Specifically, the patterning operation is repeated with differentexposure sequences so that each field on the substrate has beenpatterned using each of the four scan and step combinations discussedwith reference to FIG. 5.

FIG. 6 illustrates how four sets of calibration patterns are applied toone or more calibration substrates using different exposure sequences602, 604, 606, 608. (These exposure sequences may be applied ondifferent substrates, or they can be made as multiple exposures on thesame substrate, using offsets of the type illustrated in FIG. 3.) Asingle field 610 at top left is highlighted on each substrate. As can beseen, each patterning operation is performed using a different sequenceof scan and step movements (different exposure sequence), identified bydifferent hatching in the drawing. The first exposure sequence 602 isidentical to the one shown in FIG. 5. In this operation, the calibrationpattern is applied to the highlighted field 610 using the up/rightcombination. In the second exposure sequence 604, the calibrationpattern is applied to the highlighted field 612 in the up/leftdirection. In the third exposure sequence 606, the calibration patternis applied to the highlighted field 614 in the down/right direction. Inthe fourth exposure sequence 608, the calibration pattern is applied tothe highlighted field 616 in the down/left direction.

Referring also now to step 404 of FIG. 4, measurements are carried outon the calibration substrate(s), such as measuring the overlay errorrevealed by the targets 310, 312, 314, 316. Some or all of thecalibration measurements can for example be carried out using themetrology apparatus 240. In some examples, some or all of thecalibration measurements can alternatively be carried out using thealignment sensor AS or other sensors within the lithographic apparatusLA. All the measurement data are gathered in the database 2014 forsubsequent processing.

Referring again to FIG. 4, in step 406 the measurement data for theindividual fields is classified into sets and subsets based on variablesof interest. In this particular example, the variable of interestinclude the scan and step directions used during the patterningoperations. This step is illustrated in more detail in FIG. 7. The foursubstrates 702, 704, 706, 708 are substrates (or a single substrate)patterned using the four exposure sequences 602, 604, 606, 608 shown inFIG. 6. For clarity, only the fields patterned in the up/right directionare highlighted, although all fields have been patterned four times asdescribed above with reference to FIG. 6. All measurement data fromfields that have been patterned using the up/right combination isextracted from the measurement data for the four substrates (or foursets of targets formed on one substrate with different shifts). Themeasurement data are combined to synthesize a set of measurement datarepresenting effectively a “virtual” measured substrate 710 (UR), onwhich every field has been patterned using the up/right direction. Thisprocess is repeated extracting data relating to fields patterned usingeach of the other scan and step combinations, thereby creating fourvirtual measured substrates 710 (UR, DR, UL, DL), each of whichrepresents the performance of the lithographic apparatus during adifferent scan and step combination.

Referring again to FIG. 4, at step 408 “intra-field” and “inter-field”fingerprints are extracted from each of the four virtual measuredsubstrates, as will now be explained. As explained above, it iseffective in most cases to measure and correct separately those errorsthat recur systematically depending on the position and those errorsthat recur systematically as a function of position on the substrate asa whole.

To extract intra-field fingerprints, an “average field” is determined bycombining measurements from all the patterned fields. This average fieldprovides, for each intra-field position, estimates of the overlay aredetermined in both the X and the Y direction. Many different types ofalgorithms may be considered for this purpose, and a simple averagecould in principle be used. Separate average fields are calculated fromthe subsets of the measurement data specific to each step and scancombination (i.e. from each of the virtual measured substrates 710). Inone implementation, as a further step, an average field determined fromall the measurement data (for a given field size) forms an overallintra-field fingerprint. This overall intra-field fingerprint is thensubtracted from the average fields specific to the different scan andstep combinations. The result is a set of four residual intra-fieldfingerprints that capture the component of overlay error that isspecific to each particular scan and step combinations.

To obtain an inter-field fingerprint for each scan and step combination,the average field which has been determined as the intra-fieldfingerprint is subtracted from the virtual measured substrate at everyfield location. The residual after subtraction may be subjected ifdesired to a smoothing function. Again, in one implementation, anoverall inter-field fingerprint is calculated using all the measurementdata for a given field size, and then this is subtracted from the datasets specific to each scan and step combination, to arrive at afingerprint specific to each scan and step combination.

Recall that the steps 402 or 408 are repeated using several differentdimensions of field for the calibration patterns, and all the resultscollected in the database 2014. In step 410, the processed intra-fieldand inter-field fingerprints for all scan and step combinations and forall of the measured field sizes are used to create a predictionfunction. The prediction function can be expressed in any suitable form,it can be obtained automatically by using training algorithms, andrequires no special insight into the form of the fingerprints orunderlying causes of errors.

As explained above, the prediction function can be used to predictperformance of a lithographic apparatus and obtain correction parametersfor fields of any size or with any layout. The prediction function canprovide a prediction of inter-field or intra-field performance, or both(effectively in that case there are two prediction functions).Additionally, the prediction function(s) can in the illustratedembodiments be used to predict performance of the lithographic apparatusbased on the specific scan and step sequence used to pattern asubstrate.

In the present example, the or each prediction function has the form:v=F(x,y,w), where v is the predicted overlay vector in the X and Ydirections. Parameters x and y are the familiar coordinates within thesubstrate (inter-field prediction function) or within a field(intra-field prediction function). Additionally, however, a thirdparameter (and optionally parameters) are provided, so that theprediction function is effectively a multi-dimensional model. In oneexample, a single parameter w is used as a parameter representing fielddimensions, as will be discussed further in the following. While asingle parameter is used in this example, field size could be expressedfor example by two parameters (e.g. height and width). Whether thisadditional degree of freedom provides the model with greater accuracycan be made the subject of experiments. Statistical analysis as aby-product of the training functions will reveal how successful eachvariant is at capturing the systematic fingerprints versus randomeffects.

Individual inter-field contributions to the overlay error for aparticular scan/step combination can be predicted for any position onthe substrate, using the appropriate prediction function together withknowledge of the field dimensions (parameter w). Overlay contributionsfor each scan/step combination can generally be described as follows:

dx _(URa)=ƒ_(xURa)(x,y,w),dy _(URa)=ƒ_(yURa)(x,y,w)

dx _(DRa)=ƒ_(xDRa)(x,y,w),dy _(DRa)=ƒ_(yDRa)(x,y,w)

dx _(ULa)=ƒ_(xULa)(x,y,w),dy _(ULa)=ƒ_(yULa)(x,y,w)

dx _(DLa)=ƒ_(xDLa)(x,y,w),dy _(DLa)=ƒ_(yDLa)(x,y,w)

Values dx and dy are predictions of overlay in the x and y directions.The subscripts UR, DR, UL and DL denote Up/Right, Down/Right, Up/Leftand Down/Left scan and step combinations respectively. Suffix ‘a’ isused to indicate that this is the inter-field contribution. It will beunderstood that the function ƒ_(x) . . . , ƒ_(y) . . . for eachcombination is a prediction function. The functions do not need to bedefined analytically. They can simple statistical functions, trainedusing the relevant subset of data (710 UR, UL, DR or DL). The x and yparameters are substrate coordinates. The center of the substrate can beused as the origin for the x and y coordinates, although any spot on thesubstrate could be used as the origin if it is preferable oradvantageous to do so. The field dimension parameter w is defined asw=√{square root over (ƒcx²+ƒcy²)}, where ƒcx and ƒcy respectively denotethe distance between the center of the field and the center of thesubstrate in the X and Y directions. In other words, the parameter windicates the distance from a field center to the center of thesubstrate. The functions ƒ_(x) . . . and ƒ_(y) . . . can be calculatedand expressed in any suitable form, ranging from parametric equations tolook-up tables.

Similarly, intra-field contributions to overlay for a given field sizecan be predicted using an intra-field prediction functions for each ofthe scan and step combinations:

dx _(URb)=ƒ_(xURb)(x,y,w),dy _(URb)=ƒ_(yURb)(x,y,w)

dx _(DRb)=ƒ_(xDRb)(x,y,w),dy _(DRb)=ƒ_(yDRb)(x,y,w)

dx _(ULb)=ƒ_(xULb)(x,y,w),dy _(ULb)=ƒ_(yULb)(x,y,w)

dx _(DLb)=ƒ_(xDLb)(x,y,w),dy _(DLb)=ƒ_(yDLb)(x,y,w)

The notation used is similar to that used for the inter-fieldcontributions. Suffix ‘b’ indicates that these are the intra-fieldcontributions. For the intra-field contributions, the parameters x and yare intra-field coordinates (as opposed to substrate coordinates in thecase of inter-field contributions). Parameter w is defined as w=√{squareroot over (ƒx²+ƒy²)}, where fx and fy denote the dimensions of the fieldin the X and Y directions. In other words, the parameter w indicates thelength of the diagonal of a particular field, and thus functions as anindicator of the size of the field. As mentioned, other parameters, forexample two parameters could be used to increase the dimensionality ofthe model. With two parameters, the shape (aspect ratio) of the fieldscould be represented independently of the diagonal size.

Referring to FIG. 8 now as well as FIG. 4, in step 412, the abovespecific prediction functions for inter-field and intra-fieldcontributions are used to predict performance for a real productsubstrate having particular field dimensions and a particular exposuresequence. (Note that performance can be predicted for alternativeexposure sequences as an “experiment”, without running any specificcalibration substrates of the actual field size.) The inter-field andintra-field contributions may be predicted separately, or they may becombined into a single modeled calibration substrate.

As seen at FIG. 8 (a), the product substrate is divided into a pluralityof fields 802, 804 etc. having product field dimensions that may bedifferent from any of the field dimensions used on the calibrationsubstrates 2002 etc. (FIG. 2). While the field layout is a regular gridby convention, and other types of field layout can be envisaged. Inaddition to the field layout, an exposure sequence is specified. (Thiscould be a definitive exposure sequence that will be used in realproduction, or it could be a candidate exposure sequence being evaluatedfor possible use.) The exposure sequence can be selected automaticallyor it can be selected manually by a user. In the illustration, theexposure sequence specifies stepping directions is indicated by thearrows 816. As can be seen, the top row of product fields will bepatterned in a left-to-right stepping sequence, and alternating thestepping direction for each subsequent row of product fields.

The exposure sequence further specifies the scanning direction for eachfield. In the illustrated example, the first field to be exposed may bethe left-most field in the top row, and it will be is selected to bepatterned by scanning in the up direction. The second will accordinglypatterned by scanning in the down direction. Similarly, the right-mostfield in the second row will be patterned by scanning in the downdirection, the next field will be patterned by scanning in the updirection and so on.

Once the exposure sequence for the patterning device has beendetermined, a complete prediction of the performance of the apparatuscan be synthesized using the prediction functions obtained in step 410.This process is straightforward, as shown in FIG. 8 (b). Using the fielddimension parameter, the appropriate prediction functions fx and fy canbe used (either notionally or actually) to predict inter-field andintra-field contributions for four virtual modeled substrates 806, 808,810, 812. Each of these relates to only one of the scan and stepcombinations, indicated by hatching in the same manner as before. Theproduct field layout and exposure sequence can be notionallysuperimposed on each of the virtual modeled substrates to identify whichportions of the final prediction will be derived from which of theprediction functions. For example, the fields which are to be patternedusing the up/right combination in the specified exposure sequence areshown highlighted on the modeled substrate 806 that corresponds to theup/right combination. Portions of the modeled substrates that correspondto the position of fields to be patterned using the scan and stepdirection of each particular modeled substrate are extracted. Theextracted portions of the virtual modeled substrates are thensynthesized into a complete modeled substrate 814.

Referring once again to FIG. 4, in step 414 the modeled productsubstrate is then used to obtain one or more sets of correctionparameters for use in controlling the lithographic apparatus to applythe product pattern to product substrates. If desired, differentexposure sequences and layouts can be tried using the predictionfunctions to predict performance.

In the foregoing, the prediction function is based on measurement datafrom several pluralities of fields, each plurality of fields forming agrid pattern. Among the pluralities of fields, different ones havedifferent field dimensions. It should, however, be noted that the sameprinciples as above can be applied to predict performance undervariations other than variation of field size. For example, embodimentsmay be envisaged in which the prediction function is used to predictperformance when the grid pattern shifts, even when the field size isconstant. Then the prediction functions can predict performance in afield that is at a position different to any field position in thecalibration pattern, but without any change of field size.

FIG. 9 illustrates the method of FIG. 2 being applied in such asituation. The principles are the same as described above with referenceto FIG. 2, with similar features being labelled with like referencesigns, but with prefix “9” instead of “20”. FIG. 2 shows the principleof an exemplary method of calibration according to an aspect of thepresent disclosure. A first substrate 902 has a calibration patternapplied to a first plurality of fields 902. In the present example, thesubstrate is a calibration substrate on which a calibration pattern isapplied to a plurality of equally sized and spaced fields. A secondsubstrate 906 has a calibration pattern applied to a plurality of fields908. Optionally, a third substrate 910 and a fourth substrate 912 havecalibration patterns applied to a plurality of fields. These calibrationpatterns may differ also in field size, or position, or in some othervariable. While the present example describes the use of dedicatedcalibration patterns and dedicated calibration substrates, the terms“calibration pattern” and “calibration substrate” are not intended toexclude the use of actual product patterns for the purposes ofcalibration.

In the example of FIG. 9, the fields 904, 908 on the first and secondsubstrates in this example have the same size and shape, but havedifferent positions relative to the substrate. Field centers onsubstrate 906 may be shifted for example by a half field size in eachdirection. As in the previous examples, patterns in each layout may beapplied repeatedly, using different sequences of step and scanningmovements. This principle is illustrated in FIG. 6, described alreadyabove. Other features of the methods described above can also be appliedin this example.

In the method disclosed herein calibration measurements are performed onthe patterned substrates 902, 906, 910, 912 are used to obtaincorrections for use in controlling the lithographic apparatus whenapplying product patterns to subsequent substrates. In the presentmethod, calibration substrates and measurements are not prepared forevery different shifted position of product field. Rather, measurementdata representing the performance of the apparatus on fields of appliedusing different exposure sequences and different shifted positions(fields 904, 908 in this example) is gathered together in a database 914and used to synthesize the information needed to calibrate the apparatusfor a product layout and exposure sequence. From the database ofmeasurements of calibration substrates with different exposuresequences, a performance model 915 is derived that can be used to obtaina set of data specific to a product layout and exposure sequencedifferent from the layout and exposure sequence of the physicalcalibration patterns and measurements. The performance model is used topredict the performance of the lithographic apparatus when applying aproduct pattern with a particular product layout and exposure sequence,field size and shape, and field position.

As an example, a designed product layout for a product substratecomprises a number of fields 916. In this example, each field has fielddimensions the same as the dimensions of the fields 904, 908, but thefield centers lie at positions different from those of the field 904 or908. The designed product layout and exposure sequence are specified,together with other parameters, in a product recipe 917. The productrecipe is used with the performance model to obtain a specificperformance model 918 that predicts the performance of the lithographicapparatus when patterning a substrate using the product layout andexposure sequence specified in the recipe. For example, the predictionfor the highlighted field 940 can be obtained by interpolation frommeasurement data for the overlapping fields 942 and 944, highlighted atthe top of the drawing. When the field 940 is to be patterned using aparticular scan and step combination, measurement data for the fields942 and 944 will be selected to correspond to the scan and stepdirection of the field 940. The same process can be repeated for all thefields of the product layout.

The predicted behavior can be used as input for a correction model in alithographic apparatus. Metrology apparatus 240 of FIG. 1 can be used tomake the measurements. The measurement data can be delivered as data 242to database 914 that lies within the supervisory control system, or itmay lie within the lithographic apparatus control unit LACU. In anycase, the control unit LACU in due course receives the information itrequires for correcting any performance errors predicted by the specificperformance model, and uses the information to improve performance whenexposing product fields on real product substrates. The embodiment ofFIG. 9 can therefore be used in applications where it may be necessaryor desirable to alter a field grid pattern, without changing the fielddimensions of the fields in the field grid pattern. For example,shifting a field grid pattern in one direction may by tried to obtain ahigher product yield on production substrates. As another example, afield grid pattern may be altered subsequent to the application of afirst layer to a substrate. As described in the foregoing, fields at theedge of a substrate may result in no or only a partial yield ofproducts. It may therefore be decided that no pattern should be appliedto a particular field in further layers. As fields are appliedsequentially using a combination of scanning and stepping directions,removing a field from the field grid pattern may alter the scanning andstepping combinations used during the exposure sequence. Again, theprediction function can be used to predict performance of thelithographic apparatus when the exposure sequence is changed, even whenthere is no change of field size.

Accordingly, as shown in FIG. 9, a plurality of calibration patterns canbe applied to a plurality of fields on one or more calibrationsubstrates in a similar manner to that described with reference to FIGS.2 and 4, but without necessarily providing two or more field sizes forthe calibration pattern.

As mentioned above, the predicted performance and the correctionparameters are very closely related and one or other of them may beimplicit in the data actually prepared, rather than explicit. That is tosay, if the prediction functions predict an overlay error of, say +1.2nm in the x direction, implicitly this suggests a correction of −1.2 nmshould be applied; Provided that the control system as a wholeinterprets the values so that the predicted error is reduced when thereal pattern is applied in operation, it is a matter of choice whetherthe prediction function is designed to deliver the value +1.2 nm or −1.2nm. Consequently, terms such as “correction parameters” should not beinterpreted as excluding “predicted performance”, and vice versa.Correction parameters of course can be expressed as an array of points,but more likely they will be expressed in terms of coefficients ofpolynomials that are defined in existing alignment models and correctionfunctions.

CONCLUSION

The methods and associated lithographic apparatuses disclosed hereinenable one or more of the following benefits.

The method allows for changes in overlay error that are due to a changein (for example) field size on a substrate to be modeled and taken intoaccount without necessitating a separate calibration measurement.

The method improves the calibration process since it allows changes inoverlay due to the scanning and stepping direction of a patterningdevice during a patterning operation to be taken into account withoutincreasing the calibration burden for every new product.

The method can be implemented using new types of calibration patterns,or using existing types.

The calculations necessary to derive the prediction functions can beperformed in the lithographic apparatus, in a metrology apparatus, or inoffline systems. No hardware modification of the lithographic apparatusis required, as the correction parameters can be in the same format ascorrection parameters derived from actual measurements on a particularfield size and exposure sequence.

Although specific reference may be made in this text to the use oflithographic apparatus in the manufacture of ICs, it should beunderstood that the inspection apparatus described herein may have otherapplications, such as the manufacture of integrated optical systems,guidance and detection patterns for magnetic domain memories, flat-paneldisplays, liquid-crystal displays (LCDs), thin film magnetic heads, etc.The skilled artisan will appreciate that, in the context of suchalternative applications, any use of the terms “wafer” or “die” hereinmay be considered as synonymous with the more general terms “substrate”or “target portion”, respectively.

The terms “radiation” and “beam” used herein encompass all types ofelectromagnetic radiation, including ultraviolet (UV) radiation (e.g.having a wavelength of or about 365, 355, 248, 193, 157 or 126 nm) andextreme ultra-violet (EUV) radiation (e.g. having a wavelength in therange of 5-20 nm), as well as particle beams, such as ion beams orelectron beams.

The term “lens”, where the context allows, may refer to any one orcombination of various types of optical components, includingrefractive, reflective, magnetic, electromagnetic and electrostaticoptical components.

The invention may further be described using the following clauses:

1. A method of calibrating a lithographic apparatus, comprising:

-   -   providing first measurement data for a first plurality of fields        that have been applied by the lithographic apparatus on one or        more substrates, each field in the first plurality of fields        having a first layout;    -   providing further measurement data for one or more further        pluralities of fields that have been applied by the lithographic        apparatus on one or more substrates, each of the one or more        further pluralities of fields having a layout different from the        first layout;    -   creating a prediction function based on the first measurement        data and the further measurement data; and    -   using the prediction function to determine a set of data for at        least a first plurality of product fields having a product        layout.

2. A method according to clause 1, further comprising using thedetermined data to derive correction parameters for use in controllingthe lithographic apparatus to apply a product pattern to plurality offields on a product substrate.

3. A method according to clause 2, further comprising using theprediction function to simulate performance of the lithographicapparatus for a plurality of fields having the product layout.

4. A method according to clause 2 or 3, wherein the correctionparameters include intra-field correction parameters obtained usingintra-field components of the measurement data.

5. A method according to any of clauses 2 to 4, wherein the correctionparameters include inter-field correction parameters obtained usinginter-field components of the measurement data.

6. A method according to any of clauses 2 to 5, further comprising usingthe correction parameters to control the lithographic apparatus whenapplying the product pattern to a substrate.

7. A method according to any preceding clause, wherein the productlayout comprises product fields having a product field dimensiondifferent from a field dimension of the first plurality of fields and/orthe further plurality of fields.

8. A method according to clause 7, wherein the first plurality of fieldsand the further plurality of fields include fields having two or moredifferent dimensions.

9. A method according to clause 8 wherein the first plurality of fieldsand/or the further plurality of fields include fields having three ormore different dimensions.

10. A method according to any preceding clause, wherein the productlayout comprises product fields having a product field dimension thesame as a field dimension of some or all of the first plurality offields and the further plurality of fields, with field positionsrelative to the substrate different from field positions of the firstplurality of fields and the further plurality of fields.

11. A method according to clause 7, wherein the first plurality offields and the further plurality of fields include fields having thesame field dimensions but different field positions relative to thesubstrate.

12. A method according to any preceding clause, wherein the lithographicapparatus applies patterns to fields using a scanning motion and whereineach of the first measurement data and the further measurement datacomprises:

-   -   a first measurement data set representing performance in fields        to which the calibration pattern was applied using a first        scanning direction; and    -   a second measurement data set representing performance in fields        to which the calibration pattern was applied using a second        scanning direction.

13. A method according to clause 12, wherein the lithographic apparatusapplies patterns to fields using a scanning motion preceded by astepping motion, and wherein, in each of the first measurement data andthe further measurement data, each of the first measurement data set andsecond measurement data set comprise:

-   -   a first measurement data subset representing performance in        fields to which the calibration pattern was applied following a        stepping motion in a first stepping direction; and    -   a second measurement data subset representing performance in        fields to which the calibration pattern was applied following a        stepping motion in a second stepping direction.

14. A method according to clause 12 or 13, wherein the correctionparameters include:

-   -   correction parameters specifically for use in applying said        product pattern using the first scanning direction; and    -   correction parameters specifically for use in applying said        product pattern using the second scanning direction.

15. A method according to clause 14, wherein the correction parametersinclude:

-   -   correction parameters specifically for use in applying said        product pattern using the first scanning direction and the first        stepping direction;    -   correction parameters specifically for use in applying said        product pattern using the first scanning direction and the        second stepping direction;    -   correction parameters specifically for use in applying said        product pattern using the second scanning direction and the        first stepping direction; and    -   correction parameters specifically for use in applying said        product pattern using the second scanning direction and the        second stepping direction.

16. A method according to any of clauses 12 to 15, wherein providing themeasurement data comprises:

applying said calibration pattern sequentially to the at least onesubstrate using a sequence of scanning and stepping directions; and

performing a measurement on the applied patterns.

17. A method according to clause 16, wherein the calibration pattern isrepeatedly applied to one or more substrates using different sequencesof scanning and stepping directions.

18. A method according to clause 16 or 17, wherein the step of derivingcorrection parameters further comprises generating a multi-dimensionalmodel that models performance of the lithographic apparatus separatelyfor different combinations of the scanning and stepping directions basedon each of the obtained measurement data sets.

19. A method according to any preceding clause, wherein a calibrationpattern has been applied repeatedly to fields on the same substratewhile applying a shift between repetitions, to enable measurements torepresent separately the performance of the lithographic apparatus ineach repetition.

20. A lithographic apparatus arranged use a prediction function obtainedby a method of any of clauses 1 to 19 to derive correction parametersand using the derived correction parameters to apply a product patternto plurality of fields on a product substrate.

21. A computer program product comprising machine readable instructionswhich, when run on a suitable processor, cause the processor to performthe creating and using steps of the method of any of clauses 1 to 19.

22. A method for manufacturing a device using a lithographic apparatus,the method comprising:

-   -   defining a product layout;

deriving correction parameters for the product layout by the method ofany of clauses 1 to 19;

using the derived correction parameters to apply a product pattern toplurality of fields on a product substrate using the product layout; and

forming functional device structures on the substrate in accordance withthe applied pattern.

While specific embodiments of the invention have been described above,it will be appreciated that the invention may be practiced otherwisethan as described. Furthermore, parts of the apparatus may beimplemented in the form of a computer program containing one or moresequences of machine-readable instructions describing a method asdisclosed above, or a data storage medium (e.g. semiconductor memory,magnetic or optical disk) having such a computer program stored therein.

The descriptions above are intended to be illustrative, not limiting.Thus, it will be apparent to one skilled in the art that modificationsmay be made to the invention as described without departing from thescope of the claims set out below.

1. A method of determining data associated with a layout of fields on asubstrate processed by a lithographic apparatus, the method comprising:providing measurement data for a plurality of fields being arrangedaccording to a first layout; providing further measurement data for afurther plurality of fields being arranged according to a second layoutdifferent from the first layout; creating a prediction function based onthe measurement data and the further measurement data; and using a thirdlayout as an input for the prediction function to determine dataassociated with the third layout.
 2. The method of claim 1, furthercomprising using the determined data to derive correction parameters foruse in controlling the lithographic apparatus to apply a pattern toplurality of fields being arranged according to the third layout on asubstrate.
 3. The method of claim 2, further comprising using theprediction function to simulate performance of the lithographicapparatus for a plurality of fields being arranged according to thethird layout.
 4. The method of claim 2, wherein the correctionparameters include intra-field correction parameters obtained usingintra-field components of the measurement data, and/or wherein thecorrection parameters include inter-field correction parameters obtainedusing inter-field components of the measurement data.
 5. The method ofclaim 1, wherein the third layout comprises product fields having aproduct field dimension different from a field dimension of theplurality of fields and/or the further plurality of fields.
 6. Themethod of claim 5 wherein the plurality of fields and the furtherplurality of fields include fields having two or more differentdimensions.
 7. The method of claim 1, wherein the third layout comprisesproduct fields having a product field dimension the same as a fielddimension of some or all of the plurality of fields and the furtherplurality of fields, with field positions relative to the substratedifferent from field positions of the plurality of fields and thefurther plurality of fields.
 8. The method of claim 5, wherein theplurality of fields and the further plurality of fields include fieldshaving the same field dimensions but different field positions relativeto the substrate.
 9. The method of claim 1, wherein the lithographicapparatus applies patterns to fields using a scanning motion and whereineach of the measurement data and the further measurement data comprises:a first measurement data set representing performance in fields to whicha calibration pattern was applied using a first scanning direction; anda second measurement data set representing performance in fields towhich the calibration pattern was applied using a second scanningdirection.
 10. The method of claim 9, wherein the lithographic apparatusapplies patterns to fields using a scanning motion preceded by astepping motion, and wherein, in each of the measurement data and thefurther measurement data, each of the first measurement data set andsecond measurement data set comprise: a first measurement data subsetrepresenting performance in fields to which the calibration pattern wasapplied following a stepping motion in a first stepping direction; and asecond measurement data subset representing performance in fields towhich the calibration pattern was applied following a stepping motion ina second stepping direction.
 11. The method of claim 9, wherein thecorrection parameters include: correction parameters specifically foruse in applying said pattern using the first scanning direction; andcorrection parameters specifically for use in applying said patternusing the second scanning direction.
 12. The method of claim 10, whereinthe correction parameters include: correction parameters specificallyfor use in applying said pattern using the first scanning direction andthe first stepping direction; correction parameters specifically for usein applying said pattern using the first scanning direction and thesecond stepping direction; correction parameters specifically for use inapplying said pattern using the second scanning direction and the firststepping direction; and correction parameters specifically for use inapplying said pattern using the second scanning direction and the secondstepping direction.
 13. The method of claim 9, wherein providing themeasurement data comprises: applying said calibration patternsequentially to the at least one substrate using a sequence of scanningand stepping directions; and performing a measurement on the appliedpatterns.
 14. The method of claim 1, wherein a calibration pattern hasbeen applied repeatedly to fields on the same substrate while applying ashift between repetitions, to enable measurements to representseparately the performance of the lithographic apparatus in eachrepetition.
 15. A computer-readable recording medium having storedthereon a computer program comprising machine readable instructionswhich, when run on a suitable processor, cause the processor to performthe creating and using steps of the method of claim 1.